Nexperia, the former Standard Products division of NXP, today announced a new range of 80 V dual Power-SO8 MOSFETs in the popular LFPAK56D package.
With the addition of this new 80 V range of MOSFETs Nexperia now offers the industry’s most comprehensive portfolio of devices, ranging from 30 V to 100 V. LFPAK56D is fully automotive qualified to AEC-Q101 and has a proven track record for quality and reliability. The LFPAK56D copper clip gull wing package technology offers exceptional board level reliability in thermally demanding applications such as engine management, transmission control and ABS systems.
The LFPAK56D offers two isolated MOSFETs in one Power-SO8 package. The LFPAK56D occupies 77% less PCB space than two DPAK’s or 50% less space than a single Power-SO8 device, offering significant savings in space, weight and cost. The release of the new 80 V technology extends Nexperia’s LFPAK family of gull wing, copper clip devices in LFPAK56, LFPAK56D and LFPAK33, offering customers the ultimate flexibility to optimise their design for performance, flexibility and size.
Commented Richard Ogden, Nexperia’s product marketing for Automotive MOSFETs: “Engine management is a thermally demanding application space, with PCB modules exposed to harsh temperature cycles. These temperature cycles cause the PCB to expand and contract resulting in significant stress on the PCB solder joints. Due to the unique design of the LFPAK56D these stresses on the PCB solder joints are absorbed resulting in excellent board level reliability. By combining innovative internal and external package features the LFPAK56D is the ideal MOSFET for engine management systems.
LFPAK56D is typically used in applications such as solenoid control, motor control and DC/DC power conversion, with the 80 V portfolio specifically aimed at engine management and LED lighting applications. The full portfolio of dual Power-SO8 MOSFETs in LFPAK56D are available now.