A new small packaging options delivers up to an additional 50 percent PCB area savings and solidifies the company’s position as a market leader in small form factor, single-chip programmable logic solutions
Microsemi Corporation, provider of semiconductor solutions differentiated by power, security, reliability and performance, has announced the availability of new small form factor solutions for its mainstream, SERDES-based SmartFusion®2 System-on-Chip (SoC) FPGAs and IGLOO®2 FPGAs.
The non-volatile configuration of these two FPGA devices eliminates the need for external configuration memories, offering designers the smallest footprint available in the industry. The introduction of the new packages extends Microsemi’s portfolio of true flash-based programmable logic devices, adding a variety of small form factor packages for both device families, including the FCS325 11x11mm, VF256 14x14mm, FCV484 19×19 and VQ144 22x22mm.