At CWIEME 2013, Huntsman Advanced Materials will be showcasing its latest materials for encapsulation and insulation, demonstrating how its track record in innovation in the electronics market is helping to turn pioneering concepts for sustainable product systems into commercially viable propositions.
Encapsulation and insulation in the automotive sector
Huntsman offers a comprehensive range of organic protective solutions for electronic applications in the automotive sector. For more than 30 years, leading Tier suppliers as well as automotive OEMs have turned to the company for innovative solutions to build, structure and assemble printed circuit boards and to encapsulate, insulate and bond electrical and electronic components.
Today, initiatives to reduce C02 emissions, rising fuel prices and the growing emphasis on e-mobility are all factors that have triggered the need to develop alternative forms of propulsion in the automotive market. As a result, the electrification of powertrain systems is fast becoming a major focus for OEMs and suppliers.
Huntsman offers a wide range of encapsulating solutions which meet stringent requirements in terms of processability, thermal management, dielectric and mechanical properties. Specifically designed to protect electronic components, these systems are suitable for plug-in-hybrids, semi-hybrids, full electric vehicles and can be found in electric motors (e-motors), inverters, converters and electronic control units (ECUs).
For e-motors, Aratherm® XB 2731 is a good example of an advanced thermal conductive encapsulant offering outstanding heat conductivity (3 W/mK) and a glass transition temperature (Tg) of 160°C.
Similarly, Arathane® CW 5620 / Arathane® HY 5610 is an easy to process high-end polyurethane for ECUs which offers a low viscosity and high thermal conductivity.