Historically, the IC substrate and board industry has assumed a passive role, especially when it comes to innovation. However, in the past few years, things have changed. The dedicated landscape welcomed innovative solutions and new players.
“Today, we are facing an increasingly competitive ecosystem and players are looking to differentiate from each other’s” asserts Mario Ibrahim, Technology & Market Analyst at Yole Développement (Yole).“As the mobile segment matures with saturating growth, the value creation efforts are shifting towards emerging products, especially in Telecom & infrastructure (datacenters, 5G) and automotive.”
Substrate & PCB global market will record a modest CAGR of around 4% between 2018 and 2024. But, if we only consider advanced substrate technologies as SLP and ED technology for example, the market exhibits a much higher growth rate, up to 49% CAGR for ED over the same period… These figures are part of the new technology & market report, “Status of advanced substrates” published by Yole…
Flip Chip, SLP and ED are gaining market share from the conventional board and IC substrate markets. That’s especially true for SLP and ED, which have the capability to either reduce the board/substrate footprint, or to increase the number of dies.
“Indeed, with technology like Embedded Multi-die Interconnect Bridge (EMIB), Intel, if they decide to license the technology to external players, will be capable to compete with Interposer based packaging technology from suppliers like TSMC,” announcesStéphane Elisabeth, Cost Analyst at System Plus Consulting…
- To read the full story, please click: Advanced substrates: the wind of change
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