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Loctite Chipbonder now compatible with non-contact dispensing technology

As a leader in development of high-performance adhesives, Henkel expands its portfolio of surface-mount adhesives (SMA) with the company’s new product Loctite 3621. This adhesive has been validated for use with non-contact dispensing technologies, often referred to as jetting. This capability makes the SMA even more ideal for high-volume production environments and enables higher throughput as well as more uniform dot dimensions.

Higher yields at faster production rates are often the metrics of operational efficiency. The majority of SMAs are needle dispensed which, although adequate for many applications, does have limitations in terms of speed, as well as dot shape and size. Loctite 3621’s unique rheology makes it well-suited for non-contact dispensing processes, which helps alleviate some of the drawbacks with traditional needle dispensing. “Though Loctite 3621 can be utilized in either traditional needle dispensing or non-contact dispensing systems, customers are increasingly migrating to higher throughput options,” notes Tom Adcock, Henkel Electronic Materials Global Product Manager for Assembly Adhesives. “The speed and dot consistency available with Loctite 3621 allows higher yields.”

Accuracy and efficiency at large quantities

Using the Loctite chipbonder, non-contact dispense speed is nearly four times faster as compared to needle dispense techniques. With a small dot size (350µ/0.014” and larger), dots per hour (DPH) of up to 40,000 can be achieved with non-contact dispensing as compared to an average of 10,000 DPH with alternative methods.

In addition to its sheer speed advantage, the non-contact dispensing SMA also provides for more uniform dot dimensions and volume repeatability. Needle dispense techniques are often prone to tailing or stringing, which can result in contamination of the solder pads and, ultimately, a poor interconnect. The non-contact dispensed Loctite 3621 eliminates this concern, as it there is no tailing or stringing, dot dimensions are more spherical and dot to dot consistency is far better as compared to alternative deposition methods.

Innovation by Henkel

Other notable advantages of the latest Loctite chipbonder include the material’s lead-free wave compatibility, excellent green (wet) strength, fast cure capability of 120 seconds at 150°C and long shelf life of one month at room temperature and ten months under refrigerated storage conditions. “Consistent with Henkel’s innovation philosophy, Loctite 3621 delivers high performance in a supremely adaptable and cost-effective material system,” concludes Adcock. “With this material, speed and strength are not mutually exclusive.”

For more information on Loctite 3621 or any of Henkel’s next-generation chipbonder SMAs, log onto www.henkel.com/electronics.

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